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Manufacturing
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Assembly
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Within electronic assembly,
metal fabrications, cables, and card assemblies are joined to complete the
final product. This process is done on continuous flow lines
using KANBAN pull material handling, Demand Flow
documentation and labor techniques to include documented quality checks. |
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Printed Circuit Board
Assembly
Printed circuit boards have
parts auto inserted using UNIVERSAL insertion machines. This capability
includes:
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Two
machines each for DIP packages, axial components and radial components.
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Once
auto insertion is complete line assembly using demand flow techniques is
used to add
heatsinks, transformers, buss bars and other components not auto
insertable to the PCBs.
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Fully
populated PCBs are soldered using a DOVER SOLTEC solder wave. The wave
is programmed
with a profile for each different PCB. The profile is changed by entering the
PCBs part number into
the wave control computer.
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Profiles
contain 5 preheat chamber temperatures, solder pressure applied to
board, speed and width
of conveyor, and board size. Profiles are developed for each individual PCB
using moles to collect
temperature data as the boards are run through the wave.
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All PCBs
are tested using GENRAD automatic test equipment. These test range from
component
present test to full functional test of the PCB under load. Data collected
during the test is recorded
by serial number in the quality database.
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All PCBs are subject
to a lot inspection mechanical appearance and solder process quality
before
they are used in electronic assembly.
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Cable and Harness Assembly
Tracewell produces cable and harness
assemblies using UBANKS automatic cutting machines that cut wire to length
and strip both ends simultaneously. Lugs and terminals are applied
to the cut and stripped wires using the terminal manufacturers applicators
(E.g. AMP, ELCON, MOLEX, POSITRONICS, ERNI, BURNDI) Continuity and HiPOT
test are performed on assemblies.
All cables are subject to a lot inspection before they are used in the
electronic assembly process. |
SMT Assembly
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Corporate members of SMTA Association
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State-of-the-art equipment
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Fine pitch assembly to 12 mil. with exact precision BGA Ball Grid Array/
MBGA Micro Ball Grid Array |
Circuit Board Test &
Repair
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Software Control burn-in bays
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Advance
troubleshooting/repair to component level
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Surface mount rework and inspection
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Fabrication and
Mechanical Assembly
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Sheet metal fab
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Machining/extrusion |
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