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Manufacturing
 →  Assembly
 

Within electronic assembly, metal fabrications, cables, and card assemblies are joined to complete the final product. This process is done on continuous flow lines using KANBAN pull material handling, Demand Flow documentation and labor techniques to include documented quality checks.

Printed Circuit Board Assembly
Printed circuit boards have parts auto inserted using UNIVERSAL insertion machines. This capability includes:
▪  Two machines each for DIP packages, axial components and radial components.
▪  Once auto insertion is complete line assembly using demand flow techniques is used to add
    heatsinks,  transformers, buss bars and other components not auto insertable to the PCBs.
▪  Fully populated PCBs are soldered using a DOVER SOLTEC solder wave. The wave is programmed
   with a profile for each different PCB. The profile is changed by entering the PCBs part number into
   the wave control computer.
▪  Profiles contain 5 preheat chamber temperatures, solder pressure applied to board, speed and width 
   of conveyor, and board size. Profiles are developed for each individual PCB using moles to collect
   temperature data as the boards are run through the wave.
▪  All PCBs are tested using GENRAD automatic test equipment.  These test range from component
   present test to full functional test of the PCB under load. Data collected during the test is recorded 
   by serial number in the quality database.
▪  All PCBs are subject to a lot inspection mechanical appearance and solder process quality before
   they are used in electronic assembly.
 

Cable and Harness Assembly
Tracewell produces cable and harness assemblies using UBANKS automatic cutting machines that cut wire to length and strip both ends simultaneously.  Lugs and terminals are applied to the cut and stripped wires using the terminal manufacturers applicators
(E.g. AMP, ELCON, MOLEX, POSITRONICS, ERNI, BURNDI) Continuity and HiPOT test are performed on assemblies.
All cables are subject to a lot inspection before they are used in the electronic assembly process.
SMT Assembly
▪  Corporate members of SMTA Association
▪ 
State-of-the-art equipment
▪  Fine pitch assembly to 12 mil. with exact precision BGA Ball Grid Array/
   MBGA Micro Ball Grid Array
Circuit Board Test & Repair
▪  Software Control burn-in bays
▪ 
Advance troubleshooting/repair to component level
▪  Surface mount rework and inspection
 
Fabrication and Mechanical Assembly
▪  Sheet metal fab
▪ 
Machining/extrusion
 


©  Tracewell Systems, Inc.