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Backplanes |
| Tracewell Systems is a leader in the design and manufacture of
advanced technology backplanes for custom OEM applications and
standard architectures. Tracewell specializes in
design optimization and lower cost through reduced
layer count and improved design for
manufacture. Our experience, stringent design analysis and
quality processes ensure our backplanes meet customer
specifications every time. |
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Spectrum of Boards and
Components
We design and build backplanes ranging from basic parallel
bussed to full high speed serial mesh designs. Design
capabilities include:
▪ Board designs up to 24"
▪ Layer counts of to 50
▪ Aspect ratios as high as 11:1
▪ Multi-impedance designs
▪ Multi-point and point-to-point high speed
differential
▪ Mixed Rigid and flex designs
▪ Use of advanced PCB substrates for high-speed
multi-gigabit applications. |
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Standard Product |
Special PCB design
techniques including:
Micro, blind and buried via
Buried capacitance
Small feature imaging for micro-BGA
Extensive experience in ADSL, HDSL, SDH and ATM telecom Design |
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Simulation and Design
Characterization
We use a variety of simulation techniques as part of an integrated
engineering strategy to provide backplane solutions.
Particularly significant in applications involving high-speed signals
or unique and untested interconnect schemes, simulation allows us to
identify problem areas early in the design, resulting in faster
time-to-market.
▪ Embedded crosstalk and impedance tools for "on the fly"
layout verification
▪ 3D field solving software for model generation of complex
PCB traces an d connector pins
▪ SPICE simulation and pre-design reporting
▪ Advanced simulation and pre-design reporting
▪ Advanced design rule checks |
Elements of Design
Our expertise in transmission methodology as well as connector and
components selection assists the customer in making the best choices
early in the design. Our dynamic approach allows us to design
better backplanes, faster and more cost effectively.
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Keys areas for design
consideration:
▪ Impedance - pcb and component effect
▪ Crosstalk - forward and backward
▪ Timing - skew and propagation delay
▪ Power distribution - low noise and high current |
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Superior Manufacturing
and Test
Backplanes are built using state-of-the-art manufacturing
including large board wave and reflow soldering, high s peed
pick and place, automated connector press-fitting and leaded component
assembly to ensure
the highest quality, Tracewell performs in-circuit and functional
test, high pin count point-to-point test and automated optical
inspection on every assembly. In addition, printed circuit
boards are bareboard tested prior to component assembly.
Advanced Technology
Tracewell offers a number of advanced technology products and
capabilities. This includes sophisticated low-profile backplane
bridging systems and complex full-mesh serial designs, incorporating
the latest in high-speed board materials and differential connector
technology. Also included are small form-factor PMC node designs
that help eliminate costly unnecessary board assets. |
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